GPX C – High precision stencil printer also, for large PCBs

With Low Static Cleaning and Low Applied Pressure, SMT II creates the perfect method for removing contamination before solder paste print. Industry demands for increased traceability and integration have been addressed, SMT II comes with IPC Hermes as standard.

Application

Before Solder Paste print

Approximately 70% of defects in the   SMT  process are related to Solder Paste Print.

Quality of the solder paste print is directly related to the level of contamination on the board as it enters printing. Like its predecessor, the SMT II removes this variable from the process by cleaning the surface of the pads just before application of solder paste.

Specification

SMT II Brochure

SMT II Data sheet

SMT II Drawing

Small Machine – Great Performance

3D Inline Solder Paste Inspection system

NXT III Scalable placement Platform

AIMEX III Flexible Machine Platform

NXTR PM – FUJI “Smart Factory” Platform Stencil printer

With a PLUS of Extra Performance

3D Automated Optical Inspection System

NXTR – FUJI Smart Factory Platform

Excellent Reflow Soldering

3D Automated Optical Inspection system
Top/Bottom Double Sided simultaneous inspection