TEKNEK SMT II
With Low Static Cleaning and Low Applied Pressure, SMT II creates the perfect method for removing contamination before solder paste print. Industry demands for increased traceability and integration have been addressed, SMT II comes with IPC Hermes as standard.
Before Solder Paste print
Approximately 70% of defects in the SMT process are related to Solder Paste Print.
Quality of the solder paste print is directly related to the level of contamination on the board as it enters printing. Like its predecessor, the SMT II removes this variable from the process by cleaning the surface of the pads just before application of solder paste.