Machine de nettoyage PCB

Machine de nettoyage PCB

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With Low Static Cleaning and Low Applied Pressure, SMT II creates the perfect method for removing contamination before solder paste print. Industry demands for increased traceability and integration have been addressed, SMT II comes with IPC Hermes as standard.


Before Solder Paste print

Approximately 70% of defects in the   SMT  process are related to Solder Paste Print.

Quality of the solder paste print is directly related to the level of contamination on the board as it enters printing. Like its predecessor, the SMT II removes this variable from the process by cleaning the surface of the pads just before application of solder paste.



SMT II Brochure

SMT II Data sheet

SMT II Drawing