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TEKNEK SMT II
With Low Static Cleaning and Low Applied Pressure, SMT II creates the perfect method for removing contamination before solder paste print. Industry demands for increased traceability and integration have been addressed, SMT II comes with IPC Hermes as standard.
Application
Before Solder Paste print
Approximately 70% of defects in the SMT process are related to Solder Paste Print.
Quality of the solder paste print is directly related to the level of contamination on the board as it enters printing. Like its predecessor, the SMT II removes this variable from the process by cleaning the surface of the pads just before application of solder paste.
Specification
SMT PCB MAGAZINE RACK
1. Smooth-width adjustment using our patened rack & pinion system
2. ESD safe plastic card guides, 50 slots.
3. Heat-resistant card guides for board temperature up to 200℃.
4.Compatible with all brands of automatic loader and unloader use.
Surface Resistance: 103－109Ω
Contour Size (L×W×H)mm: 355×315×580
50pcs of Plates can be stored
The specification of PCB plates: 355×(80－250)mm
Guide slot of side plate: Depth 3.5mm, Width 7mm, Pitch 10mm
Top and bottom Base is plastic base.
Fix method: screw adjustable
Weight: 5.0KG
